Boumyoung Park

Influence of slurry components on uniformity in copper chemical mechanical planarization

Hyunseop Lee, Boumyoung Park, Haedo Jeong · Microelectronic Engineering · 2008 · 53 citations

Engineering, Materials Engineering, Materials Science +14

Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry

Boumyoung Park, Hyunseop Lee, Kihyun Park et al. · Journal of Materials Processing Technology · 2007 · 42 citations

Engineering, Materials Engineering, Materials Science +15

Mathematical modeling of CMP conditioning process

One-Moon Chang, Hyoungjae Kim, Ki-Hyun Park et al. · Microelectronic Engineering · 2007 · 41 citations

Engineering, Industrial Engineering, Mathematics +5

Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization

Hyunseop Lee, Boumyoung Park, Haedo Jeong · Journal of Materials Processing Technology · 2008 · 33 citations

Engineering, Materials Engineering, Materials Science +14

The effect of mixed abrasive slurry on CMP of 6H-SiC substrates

Hojun Lee, Boumyoung Park, Sukhoon Jeong et al. · Journal of Ceramic Processing Research · 2009 · 17 citations

Engineering, Materials Engineering, Materials Science +12