Concepedia

Lead-free ceramic ball grid array: Thermomechanical fatigue reliability

Mukta Farooq, C. C. Goldsmith, R. K. Jackson, Gregory Martin

Journal of Electronic Materials · 2003 · 13 citations · 3 references

DOI

Concepts

References

3

Foreword contributions from the 50th electronic components and technology conference

R. Boudreau · IEEE Transactions on Advanced Packaging · 2001 · 519 citations

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Reliability of Controlled Collapse Interconnections

K. C. Norris, Abraham H. Landzberg · IBM Journal of Research and Development · 1969 · 483 citations

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Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

K.S Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Materials Science and Engineering A · 2002 · 378 citations

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