2012 · 16 citations · 0 references
EngineeringComputer EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice ScalingIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationMemory DevicesVery-large-scale Integration Layout3D Integrated CircuitsMonolithic ArchitectureSingle-crystal SiliconThree-dimensional Device ScalingThree-dimensional Integrated Circuit InterconnectsThree-dimensional Integrated Circuit LayoutThree-dimensional IntegrationThree-dimensional Memory
Approaches to obtain monolithic 3D logic and memory ICs are proposed in this paper. 3-4x higher memory density with similar litho cost can be obtained with monolithic 3D memories, while benefits similar to a generation of scaling can be obtained with monolithic 3D logic by doubling the number of device layers. Well-known, manufacturing-friendly materials, process steps and device structures are used.