Concepedia

The interaction between different barrier metals and the copper surface during the chemical-mechanical polishing

D. Zeidler, Z. Stavreva, Matthias Plötner, K. Drescher

Microelectronic Engineering · 1997 · 18 citations · 3 references

DOI

Concepts

References

3

Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper Structures

Joseph M. Steigerwald, R. Zirpoli, S. P. Murarka et al. · Journal of The Electrochemical Society · 1994 · 128 citations

, , +10

Characterization of Cu chemical mechanical polishing by electrochemical investigations

D. Zeidler, Z. Stavreva, Matthias Plötner et al. · Microelectronic Engineering · 1997 · 78 citations

, , +8

Chemical-mechanical polishing of copper for interconnect formation

Z. Stavreva, D. Zeidler, Matthias Plötner et al. · Microelectronic Engineering · 1997 · 37 citations

, , +14