Prevention of blister formation in electrolessly deposited copper film on organic substrates

On the mechanism of electroless plating. II. One mechanism for different reductants

J. E. A. M. van den Meerakker · Journal of Applied Electrochemistry · 1981 · 201 citations

Natural Sciences, Materials Engineering, Materials Science +13

Via-filling using electroplating for build-up PCBs

Takeshi Kobayashi, Junichi Kawasaki, Kuniaki Mihara et al. · Electrochimica Acta · 2001 · 115 citations

Engineering, Materials Engineering, Materials Science +6

On the mechanism of electroless plating. I. Oxidation of formaldehyde at different electrode surfaces

J. E. A. M. van den Meerakker · Journal of Applied Electrochemistry · 1981 · 95 citations

Natural Sciences, Chemistry, Materials Science +16

Electroless Copper Deposition for Ultralarge-Scale Integration

Hong-Hui Hsu, Kun-Hsin Lin, Su-Jien Lin et al. · Journal of The Electrochemical Society · 2001 · 86 citations

Natural Sciences, Materials Engineering, Materials Science +17

Microstructure and ductility of electroless copper deposits

S. Nakahara, Y. Okinaka · Acta Metallurgica · 1983 · 73 citations

Natural Sciences, Materials Engineering, Materials Science +10