Fluorinated interlayer dielectric films in ULSI multilevel interconnections

Calculated elastic constants for stress problems associated with semiconductor devices

William A. Brantley · Journal of Applied Physics · 1973 · 1.2K citations

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Silicon Dioxide Deposition by Atmospheric Pressure and Low‐Temperature CVD Using TEOS and Ozone

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Plasma‐Enhanced Chemical Vapor Deposition of Organosilicon Thin Films from Tetraethoxysilane‐Oxygen Feeds

Francesco Fracassi, Ralph B. D’Agostino, Pietro Favia · Journal of The Electrochemical Society · 1992 · 97 citations

Natural Sciences, Materials Engineering, Materials Science +16

A Room Temperature Chemical Vapor Deposition SiOF Film Formation Technology for the Interlayer in Submicron Multilevel Interconnections

Tetsuya Homma, Ryuichi Yamaguchi, Yukinobu Murao · Journal of The Electrochemical Society · 1993 · 74 citations

Engineering, Materials Engineering, Materials Science +17

A Selective SiO2 Film‐Formation Technology Using Liquid‐Phase Deposition for Fully Planarized Multilevel Interconnections

Tetsuya Homma, Takuya Katoh, Yoshiaki Yamada et al. · Journal of The Electrochemical Society · 1993 · 58 citations

Engineering, Materials Engineering, Materials Science +17