The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni) lead-free solder alloy - Concepedia

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The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni) lead-free solder alloy

43

Citations

22

References

2006

Year

Fulong Zhu, Honghai Zhang, Rongfeng Guan, Sheng Liu

Microelectronic Engineering

Materials ScienceMaterials EngineeringEngineeringMechanical EngineeringTensile PropertiesHot WorkingLead-free Solder AlloyStrain RateMechanics Of MaterialsMicrostructureMetal Processing

References

	Year	Citations

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