The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni) lead-free solder alloy

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

Engineering, Materials Engineering, Materials Science +9

Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

K.S Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Materials Science and Engineering A · 2002 · 378 citations

Natural Sciences, Materials Engineering, Materials Science +11

Mechanical characterization of Sn–Ag-based lead-free solders

Masazumi Amagai, Masako Watanabe, Masaki Omiya et al. · Microelectronics Reliability · 2002 · 240 citations

Natural Sciences, Materials Engineering, Materials Science +12

Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity

Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi et al. · Materials Science and Engineering A · 2003 · 198 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder

F. Ochoa, Jason Williams, Nikhilesh Chawla · Journal of Electronic Materials · 2003 · 189 citations

Natural Sciences, Materials Engineering, Materials Science +12