Journal of Materials Science Materials in Electronics · 2010 · 12 citations · 14 references
Materials ScienceElectrical ReliabilityElectrical EngineeringConductive AdhesivesEngineeringDurability PerformanceElectromigration TechniqueCorrosionElectronic PackagingDevice ReliabilityCladding (Metalworking)MicrostructureElectrical InsulationCopper Alloy Fillers
14
Low-temperature passivation of copper by doping with Al or Mg
W. A. Lanford, Peng Ding, W. Wang et al. · Thin Solid Films · 1995 · 104 citations
Materials Engineering, Materials Science, Aluminium Nitride +5