Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives

Li‐Ngee Ho, Teng Fei Wu, Hiroshi Nishikawa, Tadashi Takemoto, Koichi Miyake, Masakazu Fujita, Koyu Ota

Journal of Materials Science Materials in Electronics · 2010 · 12 citations · 14 references

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