3
Publications
42
Citations
3
H-Index
2010
Active since
Affiliations
Teng Fei Wu is an author at The University of Osaka specializing in materials science, engineering, and electronic packaging.
Top concepts
EngineeringMaterial ScienceCorrosionElectronic PackagingElectrical InsulationElectrical EngineeringMicrostructurePolymer ScienceAdhesive MaterialsSurface Modification
Publications per year
2010–2013
3
3
Li‐Ngee Ho, Teng Fei Wu, Hiroshi Nishikawa et al. · Journal of Materials Science Materials in Electronics · 2010 · 12 citations
Materials Science, Electrical Reliability, Electrical Engineering +11
Rows per page
1–3 of 3