Concepedia

A copper/polyimide Metal-base packaging technology

H. Takasago, Kohei Adachi, Mitsuyuki Takada

Journal of Electronic Materials · 1989 · 47 citations · 0 references

Concepts

Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMetallic MaterialsPackaging DesignChip PackagingMetal PackagingPackaging EngineeringPackaging MaterialsPlastic PackagingMetal Packaging MaterialsPolymer-based Packaging