Concepedia

Publication | Closed Access

Influence of alloy composition on fillet-lifting phenomenon in tin binary alloys

DOI

22

Citations

3

References

2001

Year

Hisaaki Takao, Hideo Hasegawa
Journal of Electronic Materials

References

YearCitations

Evaluation of Lead- Free Solder Joints in Electronic Assemblies

I. Artaki, A.M. Jackson, Paul T. Vianco

Journal of Electronic Materials

1994

88

Alternative Solders for Electronics Assemblies

James H. Vincent, B. P. Richards, Danielle Wallis,

Circuit World

1993

48

Microstructural Features of Lift-Off Phenomenon in Through-Hole Circuit Soldered by Sn-Bi Alloy

Katsuaki Suganuma

Scripta Materialia

1998

35

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