Alternative Solders for Electronics Assemblies

Abstract

This is the second of two papers reporting work carried out under a programme sponsored by the Department of Trade and Industry (DTI), involving collaboration between the above companies and research centres. The objectives of the programme are to identify/develop lead‐free alternatives to Sn‐40Pb solder, progress towards the development of which is described in this paper. A number of promising alloys have been selected for trial in a further round of experimentation.