Publication | Closed Access

Microstructural Features of Lift-Off Phenomenon in Through-Hole Circuit Soldered by Sn-Bi Alloy

Materials EngineeringMaterials ScienceElectrical EngineeringMicrostructural FeaturesEngineeringNanoelectronicsLift-off PhenomenonApplied PhysicsThrough-hole Circuit SolderedElectronic PackagingMicroelectronicsMicrostructure