IEICE Transactions on Electronics · 2007 · 14 citations · 4 references
Electrical EngineeringEngineeringVlsi DesignAdvanced Packaging (Semiconductors)Vlsi ArchitectureOn-chip InterconnectsResistive TerminationComputer EngineeringTransmission LineHigh-speed NetworkingTransmission SystemOptimal TerminationElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)Electromagnetic CompatibilityOn-chip High-performance Interconnects
This paper discusses the resistive termination of on-chip high-performance interconnects. Resistive termination is effective to improve the bandwidth of on-chip interconnects, on the other hands, increases the power dissipation and the area. Therefore trade-off analysis about resistive termination is necessary. This paper proposes a method to determine the termination of on-chip interconnects. The termination derived by the proposed method provides minimum sensitivity to process variation as well as maximum eye-opening in voltage.
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