Thin Solid Films · 2008 · 44 citations · 23 references
Natural SciencesMaterials EngineeringMaterials ScienceMaterials PhysicsMetallurgyAmorphous MaterialsAmorphous SemiconductorsAmorphous SolidsDiffusion In SolidsAmorphous DefectsDefects In Amorphous MaterialsDiffusion In Amorphous SolidsTime-to-failure Analysis
23
Copper Transport in Thermal SiO2
Yosi Shacham‐Diamand, A. Dedhia, D. Hoffstetter et al. · Journal of The Electrochemical Society · 1993 · 241 citations