Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment

Pulse Method of Measuring Thermal Diffusivity at High Temperatures

Robert D. Cowan · Journal of Applied Physics · 1963 · 603 citations

Radiative Heat Transfer, Engineering, Thermal Sensing +18

Issues in the replacement of lead-bearing solders

Paul T. Vianco, D. R. Frear · JOM · 1993 · 190 citations

Defect Tolerance, Lead-bearing Solders, Lead Identification

Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use

Toshikazu Shimizu, Haruo Ishikawa, Ikuo Ohnuma et al. · Journal of Electronic Materials · 1999 · 113 citations

Materials Science, Materials Engineering, Engineering +5

Correlation of Bulk Modulus and the Constituent Element Properties of Binary Intermetallic Compounds

Chonghe Li, Ping Wu · Chemistry of Materials · 2001 · 76 citations

Materials Science, Materials Engineering, Magnetic Properties +14

On the Temperature Variation of the Bulk Modulus of Mixed Alkali Halides

P. Varotsos · physica status solidi (b) · 1980 · 66 citations

Materials Science, Temperature Variation, Engineering +7