Concepedia
Microelectronics Reliability · 2000 · 46 citations · 2 references
Electrical EngineeringEngineeringMechanical EngineeringPress-packed Igbt DesignSolid MechanicsThermal ModelingElectronic PackagingHeat TransferThermomechanical AnalysisThermal EngineeringThermomechanical ProcessingMechanics Of Materials
2
Failure analysis of power modules: a look at the packaging and reliability of large IGBTs
H. de lambilly, H.O. Keser · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 65 citations
Engineering, Large Igbts, Energy Efficiency +23
Thermal stress analysis of a multichip package design
Robert Darveaux, I. Turlik, Lih‐Tyng Hwang et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 46 citations
Engineering, Mechanical Engineering, Thermal Stress Analysis +18