Crystallographic effect on subsurface damage formation in silicon microcutting

Surface integrity in material removal processes: Recent advances

I.S. Jawahir, E. Brinksmeier, Rachid M’Saoubi et al. · CIRP Annals · 2011 · 880 citations

Materials Science, Engineering, Corrosion +6

Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining

Jiwang Yan, Tooru Asami, Hirofumi Harada et al. · Precision Engineering · 2008 · 260 citations

Diamond-like Carbon, Subsurface Damage, Engineering +9

Diamond Turning of Brittle Materials for Optical Components

Tomoaki Nakasuji, Sunao KODERA, Seiichiro Hara et al. · CIRP Annals · 1990 · 255 citations

Materials Science, Diamond-like Carbon, Optical Materials +7

Ductile-regime turning mechanism of single-crystal silicon

Takayuki Shibata, Shigeru Fujii, Eiji Makino et al. · Precision Engineering · 1996 · 172 citations

Engineering, Physics, Single-crystal Silicon +6

Velocity effects in metal forming and machining processes

R. Neugebauer, K.‐D. Bouzakis, Berend Denkena et al. · CIRP Annals · 2011 · 144 citations

Engineering, Velocity Effects, Material Machining +5