Low-Loss GaInAsP Wire Waveguide on Si Substrate with Benzocyclobutene Adhesive Wafer Bonding for Membrane Photonic Circuits

Abstract

Low-power and compact optical interconnects can be realized using III–V membrane photonic integrated circuits fabricated from thin InP-based films bonded to a Si wafer using benzocyclobutene (BCB) adhesive wafer bonding method. However, the conditions of the bonding and fabrication process strongly affect the propagation loss of waveguides. This study investigated the process conditions during bonding and waveguide fabrication with a view to reducing the propagation loss. It was found that clean, large GaInAsP thin films without air voids or fractures could be obtained by using an appropriate solvent volatilization time of 20–30 min at 200 °C for BCB. Furthermore, by using a resist with high dry etching resistance and an SiO 2 mask for the etching process, the sidewall roughness of the waveguide was significantly reduced, which finally afforded a waveguide propagation loss as low as 4 dB/cm.