The impact of delamination on stress-induced and contamination-related failure in surface mount ICs

Abstract

A temperature-cycle evaluation is reported of a large-die 132-pin plastic quad flat pack process which includes a comparison of the performances of three mold compounds, two lead frame finishes, and two die surface conditions with and without a polyimide die overcoat. The effect of contamination and moisture exposure on bond pad integrity in 68-pin leaded chip carriers damaged during solder reflow was also examined.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>