Publication | Closed Access
The impact of delamination on stress-induced and contamination-related failure in surface mount ICs
35
Citations
8
References
1992
Year
Unknown Venue
EngineeringFood PackagingTemperature-cycle EvaluationDamage MechanismAdvanced Packaging (Semiconductors)Polyimide Die OvercoatPolymer ProcessingElectronic PackagingCladding (Metalworking)Materials ScienceElectrical EngineeringHardware ReliabilityChip On BoardEngineering Failure AnalysisChip AttachmentMold CompoundsDevice ReliabilityMicroelectronicsPhysic Of FailureSurface Mount IcsAdvanced PackagingChip-scale PackageContamination-related FailureMechanics Of Materials
A temperature-cycle evaluation is reported of a large-die 132-pin plastic quad flat pack process which includes a comparison of the performances of three mold compounds, two lead frame finishes, and two die surface conditions with and without a polyimide die overcoat. The effect of contamination and moisture exposure on bond pad integrity in 68-pin leaded chip carriers damaged during solder reflow was also examined.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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