Electrochemical investigations for copper electrodeposition of through-silicon via

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X. Gagnard, Thierry Mourier · Microelectronic Engineering · 2009 · 150 citations

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Wei‐Ping Dow, Chengwei Liu · Journal of The Electrochemical Society · 2006 · 140 citations

Engineering, Materials Engineering, Materials Science +9

High-Aspect-Ratio Copper-Via-Filling for Three-Dimensional Chip Stacking

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Processor Architecture Design Using 3D Integration Technology

Yuan Xie · 2010 · 76 citations

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