Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu

The evaluation of data obtained with diffusion couples of binary single-phase and multiphase systems

Carl Wagner · Acta Metallurgica · 1969 · 636 citations

Natural Sciences, Chemistry, Materials Science +16

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14

Interdiffusion and reaction in bimetallic Cu-Sn thin films

K. N. Tu · Acta Metallurgica · 1973 · 485 citations

Natural Sciences, Materials Engineering, Materials Science +10

Kinetics of interfacial reaction in bimetallic CuSn thin films

K. N. Tu, R. D. Thompson · Acta Metallurgica · 1982 · 468 citations

Natural Sciences, Materials Engineering, Materials Science +14

Physics and materials challenges for lead-free solders

K. N. Tu, Andriy Gusak, M. Li · Journal of Applied Physics · 2003 · 356 citations

Engineering, Materials Engineering, Materials Science +17