P. J. Shang

Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu

P. J. Shang, Zhi‐Quan Liu, Dong Li et al. · Scripta Materialia · 2008 · 38 citations

Natural Sciences, Materials Engineering, Materials Science +12

The large cryogenic magnetocaloric effect of TbAl2 nanocapsules

Xiaoqing Liu, Dongling Geng, Juan Du et al. · Scripta Materialia · 2008 · 25 citations

Natural Sciences, Chemistry, Materials Science +14

Studies on synthesis and properties of novel polyurethane pavement joint sealant modified with polydimethysiloxane

Lang Xu, P. J. Shang, Xianglei Xu et al. · Materials Research Innovations · 2011 · 14 citations

Engineering, Materials Engineering, Materials Science +17

Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM

Qingsheng Zhu, Jian‐Jun Guo, P. J. Shang et al. · Advanced Engineering Materials · 2010 · 12 citations

Natural Sciences, Materials Engineering, Materials Science +15