Qingsheng Zhu

Modelling and grinding characteristics of unidirectional C–SiCs

Shuoshuo Qu, Peng Yao, Yadong Gong et al. · Ceramics International · 2021 · 153 citations

Materials Science, Materials Engineering, Engineering +7

Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition

Sujie Li, Qingsheng Zhu, Boda Zheng et al. · Materials Science and Engineering A · 2019 · 75 citations

Materials Science, Engineering, Nanomaterials +8

Effects of Zn addition on microstructure and tensile properties of Sn–1Ag–0.5Cu alloy

Hou-ding Song, Qingsheng Zhu, Zijun Wang et al. · Materials Science and Engineering A · 2009 · 60 citations

Materials Science, Materials Engineering, Engineering +8

Void-Free Copper Filling of Through Silicon Via by Periodic Pulse Reverse Electrodeposition

Qingsheng Zhu, A. Toda, Y. Zhang et al. · Journal of The Electrochemical Society · 2014 · 60 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Mechanical fatigue of Sn-rich Pb-free solder alloys

J. K. Shang, Q. L. Zeng, Long Zhang et al. · Journal of Materials Science Materials in Electronics · 2006 · 53 citations

Materials Science, Engineering, Mechanical Fatigue +6