J. K. Shang - Concepedia

Author

J. K. Shang

University of Illinois Urbana-Champaign ORCID

Also Known As

J. K. Shang, J. K. Shang *, J.K Shang, J.K. Shang, Jia Shang, JieYing Shang, Jingyi Shang

Publications

565

Citations

H-Index

Concepts

All Affiliations

University of Illinois Urbana-Champaign Chinese Academy of Sciences

About

J. K. Shang is an author at University of Illinois Urbana-Champaign specializing in materials science, engineering, and mechanics of materials.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	14	479
2	Materials Science	12	13	458
3	Applied Physics	6	6	298
4	Electrical Engineering	3	3	77
5	Materials Engineering	2	2	81

J. K. Shang

Publications

501

Citations

H-Index

Page 1

	Year	Citations
Effects of nitrogen doping on optical properties of TiO2 thin films Peihui Wu, J. K. Shang Applied Physics A Materials ScienceOptical MaterialsEngineeringOptical PropertiesOxide Electronics	2004	145
Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect P.L Liu, J. K. Shang Scripta Materialia Materials ScienceEngineeringSurface ScienceApplied PhysicsInterfacial Segregation	2001	61
Mechanical fatigue of Sn-rich Pb-free solder alloys J. K. Shang, Q. L. Zeng, Long Zhang, Journal of Materials Science Materials in Electronics Materials ScienceEngineeringMechanical FatigueMechanical EngineeringAlloy Design	2006	53
TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface Panju Shang, Zhi‐Quan Liu, D. X. Li, Journal of Electronic Materials Materials ScienceMaterials EngineeringIntermetallic CompoundsEngineeringSurface Science	2009	42
Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints L. Zhang, Zhuo Wang, J. K. Shang Scripta Materialia Materials EngineeringMaterials ScienceElectrical EngineeringFriction WeldingEngineering	2006	39
Interfacial microstructure and fracture of Al2O3 particulate reinforced AlCu composite Gang Liu, Zhehua Zhang, J. K. Shang Acta Metallurgica et Materialia	1994	22
Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current Hauyu Baobab Liu, Qingsheng Zhu, Zijun Wang, Materials Science and Engineering A Electrical EngineeringElectromigration TechniqueEngineeringMicrofabricationStress-induced Leakage Current	2010	21
Effects of Zn addition on electromigration behavior of Sn–1Ag–0.5Cu solder interconnect Hauyu Baobab Liu, Qingsheng Zhu, Zijun Wang, Journal of Materials Science Materials in Electronics Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringElectromigration Behavior	2012	17
Subcritical crack growth at bimaterial interfaces: Part I. flexural peel technique Zhehua Zhang, J. K. Shang Metallurgical and Materials Transactions A Materials ScienceEngineeringMechanical BehaviorMechanicsMechanical Engineering	1996	17
Effect of Load-Mix on Fatigue Crack Growth in 63Sn-37Pb Solder Joints Daping Yao, J. K. Shang Journal of Electronic Packaging Materials Science63Sn-37pb Solder JointsEngineeringMechanical BehaviorMechanical Engineering	1997	17

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