D. X. Li

Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates

Panju Shang, Zhi‐Quan Liu, Xueyong Pang et al. · Acta Materialia · 2009 · 133 citations

Materials Science, Materials Engineering, Material Analysis +9

Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints

Panju Shang, Zhi‐Quan Liu, D. X. Li et al. · Scripta Materialia · 2007 · 69 citations

Materials Engineering, Materials Science, Electromigration Technique +9

TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface

Panju Shang, Zhi‐Quan Liu, D. X. Li et al. · Journal of Electronic Materials · 2009 · 42 citations

Materials Science, Materials Engineering, Intermetallic Compounds +10

Microstructural investigation on the precipitation of α″ nitrides and α″ → γ′ nitride transformation in ion-nitrided pure iron

Zhi‐Quan Liu, Y. X. Chen, D. X. Li et al. · Metallurgical and Materials Transactions A · 2001 · 22 citations

Materials Engineering, Materials Science, Engineering +6

Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging

Panju Shang, Zhi‐Quan Liu, D. X. Li et al. · Philosophical Magazine Letters · 2011 · 19 citations

Materials Science, Materials Engineering, Surface Characterization +14