Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints - Concepedia

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Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints

69

Citations

13

References

2007

Year

Panju Shang, Zhi‐Quan Liu, D. X. Li, Jin Shang

Scripta Materialia

Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringApplied PhysicsMetallurgical InteractionCu3sn/cu InterfaceDefect FormationElectronic PackagingMetallurgical SystemBi-induced VoidsInterconnect (Integrated Circuits)

References

	Year	Citations

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