Solidification shrinkage defects in electronic solders

Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure

Srinivas Chada, R.A. Fournelle, W. Laub et al. · Journal of Electronic Materials · 2000 · 108 citations

Materials Science, Materials Engineering, Engineering +9

Calculation of Phase Equilibria in Candidate Solder Alloys

Ursula R. Kattner, Carol A. Handwerker · International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) · 2001 · 47 citations

Materials Science, Materials Engineering, Engineering +14

Microstructural Features of Lift-Off Phenomenon in Through-Hole Circuit Soldered by Sn-Bi Alloy

Katsuaki Suganuma · Scripta Materialia · 1998 · 35 citations

Materials Engineering, Materials Science, Electrical Engineering +9