Mode I fracture toughness testing of eutectic Sn-Pb solder joints

Fatigue of 60/40 Solder

H. D. Solomon · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1986 · 300 citations

Engineering, Mechanical Engineering, Fatigue +20

Electronic packaging materials science III

R. J. Jaccodine, Kelly A. Jackson, E.D. Lillie et al. · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 1985 · 147 citations

Engineering, System Trends, Interconnect (Integrated Circuits) +16

Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards

P. M. Hall · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1984 · 122 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +25

The metal science of joining

H. K. D. H. Bhadeshia · Materials & Design (1980-2015) · 1994 · 115 citations

Metallurgy, Materials Science, Engineering +4

Elastoplastic Analysis of Surface-Mount Solder Joints

John H. Lau, D. Rice, Philip Avery · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1987 · 64 citations

Friction Welding, Engineering, Mechanical Engineering +17