Statistics
Publications
32
Citations
1.1K
H-Index
19
Active since
1975
David J. Quesnel is an author at University of Rochester specializing in engineering, materials science, and mechanical engineering.
Publications per year
1975–2017
32
32
Effect of solid-state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joints
R. E. Pratt, E.I. Stromswold, David J. Quesnel · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1996 · 82 citations
Solder/copper Interface, Engineering, Severe Plastic Deformation +16
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