High Performance 70-nm Germanium pMOSFETs With Boron LDD Implants

Abstract

Ge pMOSFETs with gate lengths down to 70 nm are fabricated in a Si-like process flow. Reducing the LDD junction depth from 24 to 21 nm effectively reduces short-channel effects. In addition, a reduced source/drain series resistance is obtained using pure boron LDD implants over BF <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> , resulting in a significant <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">I</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub> boost. Benchmarking shows the potential of Ge to outperform (strained) Si, well into the sub-100-nm regime. The 70-nm devices outperform the ITRS requirements for <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">I</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub> by 50%, maintaining similar <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">I</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">OFF</sub> , as measured at the source.