2007 · 33 citations · 7 references
EngineeringElectrical EngineeringMicroelectronicsPower ElectronicsThermal AnalysisDevice ReliabilityReliability-based DesignSemiconductor ReliabilityThermal DesignThermal ManagementWide-bandgap Semiconductor DevicesHigh-temperature Device OperationPower Device ReliabilityPower Electronics DevicesReliability Analysis Of Power ElectronicsReliability Of Power Electronic SystemsThermal Management Of Power ElectronicsThermal Management Of Semiconductor DevicesTransportation Applications
The enhancement of the system efficiency in conjunction with a reduction of weight and volume in transportation applications requires high temperature power devices with reduced losses and with an optimized thermal management. This paper addresses the main technology issues and some recently-developed design tools to be considered in order to reach the imposed reliability level.
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Substrate-to-base solder joint reliability in high power IGBT modules
E. Herr, T. Frey, R. Schlegel et al. · Microelectronics Reliability · 1997 · 31 citations