Japanese Journal of Applied Physics · 1991 · 15 citations · 1 references
Natural SciencesMaterials EngineeringMaterials ScienceCorrosion ScienceMetallic MaterialsMetallurgyCorrosion EngineeringCorrosion KineticsCorrosion MechanismsCorrosion-resistant MaterialsLocalized CorrosionCopper CorrosionCorrosion Due To MoistureCorrosion Of Copper AlloysCorrosion ProcessesCorrosion PropagationIrradiation-assisted CorrosionLocalized Corrosion Of Copper AlloysSilicon-containing Alloys
An Al-Cu local cell was formed between the Cu precipitation and adjacent Al in an Al-Si-Cu alloy when Cu was added in excess to the alloy. Once an Al-Cu local cell was formed, corrosion took place simply by dipping the alloy in deionized water without any contamination. Furthermore, it was found that corrosion was enhanced at the Al-Si-Cu lines in contact with the p + -n junction of Si. The reason for this is that holes are injected into Al-Si-Cu from p + -Si due to electromotive force produced by light irradiation and an external circuit connecting the alloy and n-Si formed by the adsorption of moisture on the surface. Furthermore, it was found that the irradiation of light with a wavelength between 320 to 380 nm was most effective in enhancing the corrosion reaction.
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