Thermal management of electronic devices by composite materials integrated in silicon

Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking

W. Zhang, Wouter Ruythooren · Journal of Electronic Materials · 2008 · 69 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +13

Ultrafast Transfer of Metal‐Enhanced Carbon Nanotubes at Low Temperature for Large‐Scale Electronics Assembly

Yifeng Fu, Yiheng Qin, Teng Wang et al. · Advanced Materials · 2010 · 53 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +11

Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications

R.I. Rodriguez, Dimeji Ibitayo, Pedro O. Quintero · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 30 citations

Engineering, Materials Engineering, Materials Science +17

Embedded phase change material microinclusions for thermal control of surfaces

Christopher Muratore, Samir Aouadi, Andrey A. Voevodin · Surface and Coatings Technology · 2012 · 20 citations

Engineering, Materials Engineering, Materials Science +14

Drift Region Integrated Microchannels for Direct Cooling of Power Electronic Devices: Advantages and Limitations

Kremena Vladimirova, Jean-Christophe Crébier, Yvan Avenas et al. · IEEE Transactions on Power Electronics · 2012 · 19 citations

Engineering, Electrical Engineering, Mechanical Engineering +17