Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging - Concepedia

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Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging

22

Citations

2

References

2004

Year

Rao Tummala, P. Markondeya Raj, S. Atmur, Shubhra Bansal, Sounak Banerji, Fuhan Liu, Swapan Kumar Bhattacharya, Venky Sundaram, K. Shinotani, G. Edward White

Journal of Electroceramics

Materials ScienceOrganic PackagesChemical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Novel Ceramic BoardsChip On BoardFundamental LimitsElectronic PackagingActive Packaging

References

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