Development of novel ultrasonic transducers for microelectronics packaging

Computer-aided design of acoustic horns for ultrasonic machining using finite-element analysis

Saqib Amin, Musheer Ahmed, H.A. Youssef · Journal of Materials Processing Technology · 1995 · 153 citations

Engineering, Manufacturing Engineering, Mechanical Engineering +15

Ultrasonic elliptical vibration transducer driven by single actuator and its application in precision cutting

Xun Li, Deyuan Zhang · Journal of Materials Processing Technology · 2006 · 100 citations

Engineering, Manufacturing Engineering, Mechanical Engineering +12

Modeling of horns for sonic/ultrasonic applications

Stewart Sherrit, Benjamin P. Dolgin, Yoseph Bar‐Cohen et al. · 1999 · 92 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis

Yong Liu, Scott Irving, Timwah Luk · IEEE Transactions on Electronics Packaging Manufacturing · 2008 · 82 citations

Engineering, Electrical Engineering, Materials Science +17

Wirebonding at higher ultrasonic frequencies: reliability and process implications

Harry K. Charles, K. J. Mach, S. J. Lehtonen et al. · Microelectronics Reliability · 2003 · 44 citations

Natural Sciences, Materials Engineering, Materials Science +7