Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Kil-Won Moon, W. J. Boettinger, Ursula R. Kattner et al. · Journal of Electronic Materials · 2000 · 557 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

K.S Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Materials Science and Engineering A · 2002 · 378 citations

Natural Sciences, Materials Engineering, Materials Science +11

Corrosion characterization of tin–lead and lead free solders in 3.5wt.% NaCl solution

Dezhi Li, Paul Conway, Changqing Liu · Corrosion Science · 2007 · 224 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +13

Mechanical and microstructural properties of SnAgCu solder joints

Janne J. Sundelin, Sami T. Nurmi, T. Lepistö et al. · Materials Science and Engineering A · 2006 · 115 citations

Natural Sciences, Materials Engineering, Materials Science +13

Electrochemical corrosion study of Sn–3Ag–3Cu solder alloy in NaCl solution

F. Rosalbino, Emma Paola Maria Virginia Angelini, G. Zanicchi et al. · Electrochimica Acta · 2009 · 108 citations

Natural Sciences, Materials Engineering, Materials Science +17