Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

Some aspects of the growth of diffusion layers in binary systems

G. V. Kidson · Journal of Nuclear Materials · 1961 · 341 citations

Natural Sciences, Materials Science, Condensed Matter Physics +13

Intermetallic formation in gold-aluminum systems

Elliott Philofsky · Solid-State Electronics · 1970 · 224 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effects of dopant, temperature, and strain rate on the mechanical properties of micrometer gold-bonding wire

D. S. Liu · Journal of Electronic Materials · 2003 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +13

The effect of Pd and Cu in the intermetallic growth of alloy Au wire

H.W. Chang, Ker‐Chang Hsieh, Theo Martens et al. · Journal of Electronic Materials · 2003 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +12

The activation energy for electromigration and grain-boundary self-diffusion in gold

A. Gangulee, F. M. d’Heurle · Scripta Metallurgica · 1973 · 27 citations

Natural Sciences, Materials Science, Physics +12