Yongjin Park

Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

Hyoung-Joon Kim, Joo Yeon Lee, Kyung-Wook Paik et al. · IEEE Transactions on Components and Packaging Technologies · 2003 · 224 citations

Natural Sciences, Materials Engineering, Materials Science +17

Structural-relaxation-driven electron doping of amorphous oxide semiconductors by increasing the concentration of oxygen vacancies in shallow-donor states

Han‐Wool Yeon, Seungmin Lim, Jung‐Kyu Jung et al. · NPG Asia Materials · 2016 · 64 citations · Full text

Natural Sciences, Materials Science, Physics +17

Nanoscale enzyme reactors in mesoporous carbon for improved performance and lifetime of biosensors and biofuel cells

Ki Young Kwon, Jongkyu Youn, Jae Hyun Kim et al. · Biosensors and Bioelectronics · 2010 · 45 citations

Engineering, Biotechnology, Chemical Engineering +17

Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability

Sangah Gam, Hyoung-Joon Kim, Jong-Soo Cho et al. · Journal of Electronic Materials · 2006 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +13

Evaluation of Contributing Factors Affecting Number of Vehicles Involved in Crashes Using Machine Learning Techniques in Rural Roads of Cosenza, Italy

Giuseppe Guido, Sina Shaffiee Haghshenas, Sami Shaffiee Haghshenas et al. · Safety · 2022 · 39 citations · Full text

Computing, Computer Science, Artificial Intelligence +16