Publication | Closed Access
Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability
40
Citations
8
References
2006
Year
Materials ScienceMaterials EngineeringElectromigration TechniqueEngineeringCorrosionPd AdditionSurface ScienceApplied PhysicsBond ReliabilityElectronic Packaging
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