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Elastic strain in In0.18Ga0.82N layer: A combined x-ray diffraction and Rutherford backscattering/channeling study
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Citations
14
References
1999
Year
Wide-bandgap SemiconductorX-ray SpectroscopyEngineeringSevere Plastic DeformationIngan LayerElastic StrainMicrostructure-strength RelationshipMaterials SciencePhysicsCrystalline DefectsStrain LocalizationAluminum Gallium NitrideSolid MechanicsGan Intermediate LayerCategoryiii-v SemiconductorMicrostructureCombined X-ray DiffractionSurface ScienceApplied PhysicsX-ray DiffractionGan Power DeviceIn0.18ga0.82n LayerMechanics Of Materials
An InGaN layer was grown by metalorganic chemical vapor deposition on a sapphire (0001) substrate using a thick (>2.2 μm) GaN intermediate layer. The In composition, which cannot be unambiguously determined by x-ray diffraction (XRD) or by photoluminescence, was determined by Rutherford backscattering (RBS). The perpendicular and parallel elastic strain of the In0.18Ga0.82N layer, e⊥=+0.21% and e∥=−0.53%, respectively, were derived using a combination of XRD and RBS/channeling. The small ratio |e⊥/e∥|=0.40 indicates that the In0.18Ga0.82N layer is much stiffer in the c-axis direction than in the a-axis direction.
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