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Effects of different drop test conditions on board-level reliability of chip-scale packages

ReliabilityReliability EngineeringEngineeringBoard-level ReliabilityChip-scale PackageAdvanced Packaging (Semiconductors)Hardware ReliabilitySoftware TestingComputer EngineeringChip-scale PackagesChip AttachmentElectronic PackagingDevice ReliabilityMicroelectronics