Concepedia

The Effect of Sn Orientation on Intermetallic Compound Growth in Idealized Sn-Cu-Ag Interconnects

Chris Kinney, Xioranny Linares, Kyu-Oh Lee, J. W. Morris

Journal of Electronic Materials · 2013 · 28 citations · 16 references

DOI

Concepts

References

16

Current-induced marker motion in gold wires

H. B. Huntington, A. Gröne · Journal of Physics and Chemistry of Solids · 1961 · 836 citations

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Interstitial Diffusion of Copper in Tin

B. F. Dyson, T. R. Anthony, David Turnbull · Journal of Applied Physics · 1967 · 382 citations

, , +6

The superstructure of domain-twinned η'-Cu<sub>6</sub>Sn<sub>5</sub>

Lars Stenberg, Sven Lidin · Acta Crystallographica Section B Structural Science · 1994 · 274 citations

, , +16

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Brook Chao, Seung‐Hyun Chae, Xuefeng Zhang et al. · Acta Materialia · 2007 · 209 citations

, , +16

Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin

D. C. Yeh, H. B. Huntington · Physical Review Letters · 1984 · 188 citations

, , +14