Kyu-Oh Lee

The Effect of Sn Orientation on Intermetallic Compound Growth in Idealized Sn-Cu-Ag Interconnects

Chris Kinney, Xioranny Linares, Kyu-Oh Lee et al. · Journal of Electronic Materials · 2013 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +11

Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints

Amaneh Tasooji, Leticia Lara, Kyu-Oh Lee · Journal of Electronic Materials · 2014 · 24 citations · Full text

Engineering, Electrical Engineering, Materials Engineering +9

Ultra-thin dual polarized millimeter-wave phased array system-in-package with embedded transceiver chip

Telesphor Kamgaing, Adel Elsherbini, Sasha N. Oster et al. · 2015 · 19 citations

Engineering, Electrical Engineering, Materials Science +17

The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration

Xioranny Linares, Chris Kinney, Kyu-Oh Lee et al. · Journal of Electronic Materials · 2013 · 15 citations

Engineering, Materials Engineering, Materials Science +17