Publication | Open Access
Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints
24
Citations
8
References
2014
Year
Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringCorrosionMechanical EngineeringMetallurgical InteractionGrain Boundary MisorientationElectronic PackagingLead-free Solder JointsMicrostructure
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