Applied Physics Letters · 2007 · 21 citations · 13 references
EngineeringMaterials EngineeringMaterials ScienceFinite Element AnalysisMaterials CharacterizationSemiconductor MaterialsElectron MicroscopySemiconductor HeterostructuresStrain AnalysisStrain MeasurementStress-strain BehaviorTransmission Electron MicroscopyDislocation DynamicsDislocation GlideFilm StrainFilm-substrate InteractionFinite Element SimulationGeometric Phase EffectsStrain RelaxationStress Measurement
Relaxation of strain by a partial dislocation and stacking fault in a strained Si film was characterized using geometric phase analysis of high-resolution transmission electron microscope (HRTEM) images. Movement of a 60° glide dislocation from the free surface to the film-substrate interface created a complex state of strain in the film. HRTEM image analysis was used to produce a quantitative measure of the atomic displacement fields that could be used as input to finite-element simulations of stress distributions and resulting affects on band structures.
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Generation of misfit dislocations in semiconductors
P. M. J. Marée, J. C. Barbour, J. F. van der Veen et al. · Journal of Applied Physics · 1987 · 474 citations
Natural Sciences, Materials Engineering, Materials Science +17