The effect of strain rate and temperature on the tensile properties of Sn–3.5Ag solder

Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders

H. Mavoori, Jason Chin, Semyon Vaynman et al. · Journal of Electronic Materials · 1997 · 235 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder

F. Ochoa, Jason Williams, Nikhilesh Chawla · Journal of Electronic Materials · 2003 · 189 citations

Natural Sciences, Materials Engineering, Materials Science +12

Solders in electronics

W. J. Plumbridge · Journal of Materials Science · 1996 · 116 citations

Creep of tin, Sb-solution-strengthened tin, and SbSn-precipitate-strengthened tin

Rodney J. McCabe, M. E. Fine · Metallurgical and Materials Transactions A · 2002 · 107 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

Yoshiharu Kariya, Masahisa Otsuka · Journal of Electronic Materials · 1998 · 96 citations

Natural Sciences, Materials Engineering, Materials Science +11