Concepedia

Electromigration resistance-related microstructural change with rapid thermal annealing of electroplated copper films

Dukryel Kwon, Hyunah Park, Chongmu Lee

Thin Solid Films · 2004 · 19 citations · 4 references

DOI

Concepts

References

4

Grain Growth in Thin Films

Carl V. Thompson · Annual Review of Materials Science · 1990 · 637 citations

, , +17

Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films

Shefali Vaidya, A. K. Sinha · Thin Solid Films · 1981 · 354 citations

, , +12

Metallization: theory and practice for VLSI and ULSI

Choice Reviews Online · 1993 · 209 citations

, , +17

Copper metalorganic chemical vapor deposition reactions of hexafluoroacetylacetonate Cu(I) vinyltrimethylsilane and bis (hexafluoroacetylacetonate) Cu(II) adsorbed on titanium nitride

Vincent M. Donnelly, M. E. Gross · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1993 · 78 citations

, , +17