Signature Testing of Analog and RF Circuits: Algorithms and Methodology

R. Voorakaranam, S. Sermet Akbay, Soumendu Bhattacharya, S. Cherubal, Abhijit Chatterjee

IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications · 2007 · 116 citations · 35 references

Concepts

TL;DR

Production test costs for RF and high‑speed analog circuits are rising due to expensive test equipment and lengthy performance tests. The paper proposes a low‑cost signature test methodology to accelerate production testing of analog and RF integrated circuits. The method generates test waveforms that directly predict performance specifications from the DUT’s signature response, optimizes stimulus to minimize prediction error, and extends to RF ICs by modulating a baseband stimulus and demodulating the response. The solution can be implemented on a load board compatible with inexpensive testers.

Abstract

There are mainly two factors responsible for rapidly escalating production test costs of today's RF and high-speed analog circuits: 1) the high cost of high-speed and RF automatic test equipments and 2) long test times required by elaborate performance tests. In this paper, we propose a low-cost signature test methodology for accelerated production testing of analog and RF integrated circuits. As opposed to prior work, the key contribution of this paper is a new test generation algorithm that directly tracks the ability of input test waveforms to predict the test specification values from the observed test response, even in the presence of measurement noise. The response of the device-under-test (DUT) is used as a "signature" from which all of the performance specifications are predicted. The applied test stimulus is optimized in such a way that the error between the measured DUT performances and the predicted DUT performances is minimized. While existing low-cost test approaches have only been applied to low- and medium-frequency analog circuits, the proposed methodology extends low-cost signature testing to RF integrated circuits by incorporating modulation of a baseband test stimulus and subsequent demodulation of the obtained response to obtain the DUT signature. The proposed low-cost solution can be easily built into a load board that can be interfaced to an inexpensive tester

References

35