Microlens array fabrication by backside exposure using Fraunhofer diffraction

A tapered hollow metallic microneedle array using backside exposure of SU-8

Kabseog Kim, Daniel S. Park, Hong Lu et al. · Journal of Micromechanics and Microengineering · 2004 · 210 citations

Engineering, Materials Engineering, Materials Science +15

Reduction of diffraction effect of UV exposure on SU-8 negative thick photoresist by air gap elimination

Yun-Ju Chuang, Fan‐Gang Tseng, Wen Kuang Lin · Microsystem Technologies · 2002 · 124 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of exposure dose on the replication fidelity and profile of very high aspect ratio microchannels in SU-8

Jun Zhang, Mary B. Chan‐Park, Samuel R. Conner · Lab on a Chip · 2004 · 87 citations

Engineering, Manufacturing Engineering, Materials Science +17

Building thick photoresist structures from the bottom up

Mark C. Peterman, Philip Huie, D. M. Bloom et al. · Journal of Micromechanics and Microengineering · 2003 · 55 citations

Engineering, Manufacturing Engineering, Materials Engineering +17

Wall profile of thick photoresist generated via contact printing

Yao Cheng, Ching-Yo Lin, Der‐Hsin Wei et al. · Journal of Microelectromechanical Systems · 1999 · 47 citations

Engineering, Manufacturing Engineering, Materials Engineering +10